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• The current trend of consumer electronics products is based on the concepts of “light, thin, short, and small”. • The easy winding and thinness of the flexible circuit board make the application requirements grow faster than ever before • Electromagnetic interference generated between individual electronic components and circuit boards cannot be avoided in any electronic product installation. In order to shield the electromagnetic interference and maintain the EMI FILM, it is a solution to the flexible circuit board. Inktec’s EMI products take ultra-thin and ultra-high frequency wireless transmission as the main shaft demand, and gain market opportunities. This series of products are introduced in the following table.
In recent years, more and more mobile phones and wearable devices and other IT products are equipped with wireless charging functions. In order to reflect the functional effects, the demand for thinning of such products has increased. Along with this trend, Inktec has developed a market. There is no ultra-thin, high-segment BT series black cover film. These new materials will lead the market in the future. They will be used in electric vehicles, smart appliances, drones, medical equipment, industrial robots, etc. The following table.
Thermosetting CBF mainly used in FPC reinforcements, Inktec products have stable adhesive strength, shielding of noise effects, and the ability to strengthen the ground, high conductivity, good resistance to reflow adhesion, this series of products introduced in the following table